Intel Breaks Ground in the Silicon Heartland

LICKING COUNTY, Ohio--(BUSINESS WIRE)--Sep 9, 2022--

What’s New: Today, President Joe Biden joins Intel, Ohio Gov. Mike DeWine and other federal, state and local officials to celebrate breaking ground in the Silicon Heartland on two of the world's most advanced chipmaking facilities. As part of Intel’s commitment to develop a skilled talent pipeline for its two new leading-edge chip fabs, Intel also announced the first phase of funding for its Ohio Semiconductor Education and Research Program. During this first phase, Intel is providing $17.7 million for eight proposals from leading institutions and collaborators in Ohio to develop semiconductor-focused education and workforce programs.

Intel’s Ohio Semiconductor Education and Research Program will fund collaborative proposals led by eight Ohio schools. These eight proposals involve more than 80 institutions of higher education across the state. The eight leading institutions will receive $17.7 million in funding over three years as part of Intel’s $50 million commitment to Ohio higher education institutions over the next decade. (Credit: Intel Corporation)

“Today marks a pivotal moment in the journey to build a more geographically balanced and resilient semiconductor supply chain. The establishment of the Silicon Heartland is testament to the power of government incentives to unlock private investment, create thousands of high-paying jobs, and benefit U.S. economic and national security. We would not be here today without the support of leaders in the administration, Congress and the state of Ohio, who share a vision to help restore the United States to its rightful place as a leader in advanced chipmaking.”
—Pat Gelsinger, Intel CEO